For the quality purpose of one-time pass rate and high reliability of SMT chip plug-in processing, it is necessary to control the design of printed circuit boards, components, materials, processes, equipment, rules and regulations, etc. Among them, process-based control is particularly important in the SMT patch proofing manufacturing industry. In each step of the SMT patch proofing manufacturing process, reasonable testing methods must be followed to prevent various defects and hidden dangers before entering the next process.

SMT chip plug-in processing and welding inspection is a comprehensive inspection of welding products. The common points that need to be tested are: whether the surface of the spot welding is bright, whether there are holes, holes, etc.; whether the spot welding is crescent-shaped, whether there is more tin and less tin, whether there are monuments, bridges, moving parts, missing parts, Defects such as tin beads. Whether each component has different degrees of defects; search for defects such as short circuit and conduction during welding, and check the color change on the surface of the printed circuit board.

The quality inspection of SMT chip plug-in processing includes incoming material inspection, process inspection and surface assembly board inspection. Quality problems found in process testing can be corrected according to rework conditions. The rework cost of defective products found in incoming material inspection, solder paste printing and pre-soldering tempering is relatively low, and the impact on the reliability of electronic products is relatively small. But the rework of defective products after soldering is completely different. Since post-soldering rework requires re-soldering after desoldering, in addition to working time and materials, components and circuit boards will also be damaged. According to defect analysis, the quality inspection process of SMT patch proofing can reduce the defect rate and reject rate, reduce the cost of rework and maintenance, and prevent the occurrence of quality damage from the source.

In the patch processing process, to ensure the soldering quality of the printed circuit board, it is necessary to always pay attention to whether the reflow soldering process parameters are reasonable. If there is a problem with the parameter settings, the soldering quality of the printed circuit board cannot be guaranteed. Therefore, under normal conditions, the furnace temperature must be tested twice a day and the low temperature test once. As long as the temperature curve of the welded product is perfected from time to time and the temperature curve of the welded product is set, the quality of the processed product can be guaranteed.

The quality inspection of special SMT patch plug-in processing must be very strict, only strict quality inspection can ensure the quality of SMT processed products is reliable. In the Pearl River Delta region, SMT factories are everywhere, and it can be said that nine of the ten industrial zones have electronic processing factories. To survive and expand in this environment, it is a prerequisite to ensure product quality.